Hamid Hadim

Dr. Hadim’s research involves thermal transport in micro/nano systems, sustainable energy systems, innovative microelectronics cooling techniques, multi-disciplinary design and optimization in electronics and MEMS packaging and thermal convection and fluid dynamics in porous media.

He is working with Professor Chassapis towards advancement of the Clean Energy Institute, thanks to recent funding from the New Jersey Commission on Science and Technology NJCST. Dr. Hadim is also an integral part of the interdisciplinary team of professors that has been awarded $2.365 million to conduct research for a US ARMY Research, Development and Engineering Command-Armament Research, Development and Engineering Center (RDECOM-ARDEC) National Small Arms Center (NSAC) Task Order Sub-Agreement (TOSA), titled “A Standalone/Networked Compact, Low Power, Imagefused, Multi-spectrum Sensor System for Target Acquisitions, Tracking and Fire Control.”

Dr. Hadim is a member of the American Society of Mechanical Engineers (ASME) and the American Society of Engineering Education (ASEE). He is a recipient of the Alexander Humphreys Distinguished Teaching Award, Stevens Institute of Technology, the Jess H. Davis Memorial Research Award, NSF travel grant to participate in NSF-sponsored workshop titled:"Frontiers in Transport Phenomena Research & Education: Energy Systems, Security, IT and Nanotechnology," University of Connecticut, the Dean's Recognition for Excellence in Teaching, Stevens Institute of Technology, and the recipient of Stevens Research Initiation Grant.

Research Images:
Selected Publications:
Suwa, T., and Hadim, H.. (Sep 2008). Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm, Microelectronics J., 39 (6)
Suwa, T., and Hadim, H.. ( 2008). Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm, Microelectronics Journal, Vol. 39, No. 6, pp. 1200-1208
Hadim, H. and Suwa, T.. ( 2008). Integrated Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review, ASME Journal of Electronic Packaging, Vol. 130, No. 3, pp. 1-10
Suwa, T., and Hadim, H.. ( 2007). Multidisciplinary Placement Optimization of Heat Generating Electronic Component on a Printed Circuit Board in an Enclosure, IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 3, pp. 402-410
Suwa, T., and Hadim, H.. ( 2007). Multidisciplinary Electronic Package Design and Optimization Methodology Based on Genetic Algorithm, IEEE Transactions on Advanced Packaging, Vol. 30, No. 3, pp. 402-410
Collaborators:
Constantin ChassapisFrank Fisher
Contact Information:

Hamid Hadim
ahadim@stevens.edu
Phone: 201.216.5569
E319
Castle Point on Hudson
Hoboken NJ 07030

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